High Density Memory Arrays:

  • Dual Channel Architectures for Popular Processor Support
  • Capacity to 8GB in 16x22mm BGA
  • Fast: Speeds to 1866Mbs
  • Wide Word Widths: x32/x64/x72/x80 bits
  • Extended Temperature Performance: to -55 +125oC
  • Low Power Option at Full Speed


  • Board Area Savings up to 85%
  • Low Height Profile: 1.2 to 1.7mm
  • Low Power up to 50% of standard DIMM equivalent memory
  • Mechanically Rugged: No Connectors
  • Improved Signal Integrity
  • Reduced Main Board Interconnect
  • Easy Replacement for Discrete SDRAM

Solution Comparison